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Electronic Packaging Materials
Ferro provides a full range of thick-film packaging materials, thick-film component materials and glass powders used in the production of hybrid circuits, microelectronics, advanced packaging, and devices.




Multilayer Materials
We supply a wide variety of materials for all chip component applications, including additives and setter sands; barium titanates, pastes for components, and dielectric formulations for ceramic capacitors and for high-frequency applications. 





(Click here for Surface Technologies, CMP, and Metal Powders and Flakes products.)