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Electronic Packaging Materials
Ferro provides a full range of thick-film packaging materials, thick-film component materials and glass powders used in the production of hybrid circuits, microelectronics, advanced packaging, and devices.

Multilayer Materials
We supply a wide variety of materials for all chip component applications, including additives and setter sands; barium titanates, pastes for components, and dielectric formulations for ceramic capacitors and for high-frequency applications. 

View details on our full range of Electronic Packaging Materials, Component Materials and Glass Materials.

Ferro's Electronic Packaging Materials product and services portfolio has expanded with the addition of Electro-Science Laboratories (ESL). ESL was acquired by Ferro on October 31. We look forward to bringing customers a broader solutions offering as we blend our teams and capabilities. Visit ESL.

(Click here for Surface Technologies, CMP, and Metal Powders and Flakes products.)