Ferro researchers have published a number of papers on CMP and Surface Technology:

• “Recent Advances in the Development of Ceria-Based Slurries for Inner Layer Dielectric CMP,” Her, B., Merricks, D., Santora, B., Goodman, H., Proceedings of the 21st International VMIC, Hawaii, September 2004.
• “Recent Advances in the Development of Ceria-Based Slurries for Inner Layer Dielectric CMP,” Her, B., Merricks, D., Santora, B., Goodman, H., Proceedings of the PacRim Conference, Tokyo, Japan, December 2004, p147.
• “Recent Advances in Ceria-Based Slurries for STI and ILD CMP Applications,” Merricks, D., Santora, B., Her, B., Proceedings of the ISTC, Shanghai, China, 2005, p693.
• “Ceria Based Slurries for STI and 'Self-Stopping' ILD Polishing: Novel Formulations and Mechanistic Understanding,” Santora, B., Merricks, D., Frink, S., Kraft, B., Her, B., Proceedings of the 22nd International VMIC, Fremont, CA, October 2005.
• “An Investigation of Ceria-Based Slurries Exhibiting Reverse-Prestonian Behavior,” Merricks, D., Santora, B., Frink, S., Her, B., Proceedings of the PacRim Conference, Seoul, Korea, November 2005, p45.
• “Recent Advances in Ceria-Based Slurries for STI and ILD CMP Applications,” Santora, B., Her, B., Merricks, D., Proceedings of the ICPT, San Jose, CA, 2006.
• “Low Defectivity Ceria-Based Slurries: Novel Selectivity, Slurry Characterization and Polishing Mechanisms,” Merricks, D., Santora, B., Liu, H., Her, B., Kraft, B., Frink, S., Goodman, H., Hofmann, C., Zedwick, C., Proceedings of the ISTC, Shanghai, China, 2007, p332.
• “The Real Impact of Selectivity on CMP Performance,” Zedwick, C., Merricks, D., Frink, S., Santora, B., Her, B., Proceedings of the 13th International CMP-MIC, Fremont, CA, March 2008.
• “Evolution and Revolution of Cerium Oxide Slurries in CMP,” Merricks, D., Santora, B., Her, B., Zedwick, C., Proceedings of the ISTC, Shanghai, China, 2008, p531.
• “Development and Mechanisms of Action of a Ceria-Based Slurry for Shallow Trench Isolation CMP,” Merricks, D., Santora, B., Her, B., Zedwick, C., Proceedings of the CSMIC, Shanghai, China, 2008, p87.
• "Shaping the Future," Santora, B., Her, B., Goodman, H., Evans, T., Merricks, D., Ceramic Industry, March 2008.
• "Enhanced High-Frequency LTCC for RF and Microwave Packaging,” Henry, J., Gardner, B., Graddy, E., Stadnicar, E., Shaikh, A., IMAPS ATW Sept. 16-18, 2008, San Diego, CA.
• “Effect of Process Variables on Frit Bonding in MEMS Wafer Level Packaging,” Sridharan, S., Henry, J., Maloney, J., Gardner, B., Mason, K., Dragoi, V., Pabo, E., Cakmak, E., Tang, T. , 10th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications – ECS-PRiME2008, October 12-17, 2008, Honolulu, HI.