Ferro Electronic Material Systems is a member of the CMP module of the SiLKnet Alliance, developing slurry chemistries and processes compatible with SiLK and porous SiLK integrated wafer polishing. This site contains technical information in the form of reports, papers and presentations on copper/low-k integration and advanced interconnect technology.

Evaluation of CMP-Stop Layers using Ferro Electronic Material Systems Slurries

Development of Slurries for Polishing SiLK™-Integrated Wafers  (IITC 2003 Presentation)

Development of Slurries for Selective and Non-Selective Polishing Schemes using SiLK™ Integrated Wafers  

CMP in Copper/Low-k Dielectric Integration Schemes