Electronic Packaging Materials
Ferro's Electronic Packaging Materials (EPM) business provides a full range of materials and engineered products for hybrid circuits, microelectronics, advanced packaging, and devices. Our product line includes high-purity glass frit and powders for high-tech applications as well as microcircuit and specialty thick film products for the hybrid microelectronic, photovoltaic, surge resistor, display, MEMS device, LTCC packaging and associated markets.
Surface Technologies and CMP
Surface Technologies manufactures a wide range of aluminum, cerium and zirconium oxides. These products are used to surface finish ceramic, glass, metal and plastic substrates. The CMP products find application in planarizing various levels of semiconductor chips at the STI (Shallow Trench Isolation) and ILD (Inner Layer Dielectric) levels.
Metal Powder and Flake Products
Ferro's Metal Products group offers a broad range of standard precious and base metal products. Through close cooperation with customers, we are capable of developing specialized products to meet unique applications. Our facilities are capable of producing developmental to multi-metric ton volumes of our standard or custom products. With our extensive standard product offerings, research, applied technology and analytical resources, we are prepared to assist your technology programs.
Ferro offers the industry's broadest line of dielectrics, terminations, electrodes and binders for multilayer ceramic capacitors and other passive components.
Ferro sold its solar pastes business to Heraeus on February 6, 2013. Learn more.