Ferro Electronic Material Systems offers a wide variety of ceramic and metal additive materials to improve the performance of organic compounds used in a broad range of applications. These additives enhance conductivity, improve high-frequency performance, alter permittivity, modify sealing characteristics, improve flame resistance, improve moisture resistance and provide many other benefits.
Additives
Ferro additives for filled polymers include large particle size pure titania compounds as well as precious metal powders. The table below lists specific products and applications. Additives include:
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- Zirconium Oxide
- Ceramic Powders
- Silver Flake
- Silver/Palladium Powders
- Platinum Flake
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End Uses
Each application requires specific physical characteristics to be successful, and Ferro's engineering team has the ability to adjust these variables to meet your unique needs for filled polymers applications. For example, we can vary the amount of barium and strontium in an additive to shift the Curie Point of the composite material, enhancing performance over a specific temperature range.
Applications for these materials include:
- Copier toner formulations to improve adhesion.
- Printing ink additives to prevent check counterfeiting.
- Rubber formulations to enhance wetting and adhesion in boots and tires.
- Electroluminescent lighting.
- Compounding agent for polymer antennas.
- Adhesive and epoxy materials to increase conductivity.
- Filler for circuit boards to increase dielectric constant or improve frequency response of a circuit board made with a polymer ceramic composite.
Contact your Ferro sales representative to explore the possibilities to create new high technology applications for the future of electronics.
Materials and Applications
| Ceramic Powders |
Typical Application |
Particle Size Dist. (µm) |
Surface
Area (m2/g) |
| D90 |
D50 |
D10 |
| 104-2 Zirconium Oxide I |
Plastic filler |
3.3 |
0.8 |
0.34 |
10.51 |
| 119 Barium Zirconate |
Plastic seals and molding |
3.1 |
1.0 |
0.61 |
4.16 |
| 203-4 Titanium Dioxide |
Filled polymers to reduce dielectric constant and promote high frequency performance |
1.7 |
1.1 |
0.65 |
4.7 |
| Ticon® HG Titanium Dioxide |
Filled polymers to reduce dielectric constant and promote high frequency performance |
4.5 |
3.0 |
1.5 |
2.3 |
| Ticon® CG Titanium Dioxide |
Filled polymers to reduce dielectric constant and promote high frequency performance |
7.2 |
4.0 |
1.9 |
– |
| 217 Calcium Titanate |
Polymer antennas and other telecom applications |
4.2 |
1.6 |
0.75 |
4.55 |
| 218 Strontium Titanate |
Filled polymers to promote high frequency performance; toners and anticounterfeiting applications |
4.6 |
2.0 |
0.93 |
1.81 |
| Ticon® 55 Strontium Titanate |
Filled polymers to promote high frequency performance |
2.9 |
1.1 |
0.5 |
4.3 |
| 219-6A Barium Titanate |
Dielectric constant booster for filled circuit boards, electroluminescent lights and other filled applications |
2.1 |
1.3 |
0.8 |
2.1 |
| Ticon® C Barium Titanate |
Dielectric constant booster in filled circuit boards and other filled applications |
3.8 |
1.5 |
0.6 |
2.4 |
| Ticon® HPB Barium Titanate |
Electroluminescent lighting |
2.1 |
1.0 |
0.4 |
3.2 |
| BST Barium Strontium Titanate |
Filled polymers to promote targeted high-frequency performance |
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| 320A Bismuth Trioxide |
Density modifier for plastics |
16 |
6.1 |
1.5 |
0.2-0.5 |
| AD143N Ceramic Powder |
Dielectric constant booster in filled circuit boards and other filled applications |
1.9 |
0.9 |
0.5 |
3.0 |
| Metals |
Typical Application |
Particle Size Dist. (µm) |
Surface
Area (m2/g) |
| D90 |
D50 |
D10 |
| SF9ED Silver Flake |
Seals and filled epoxy resins |
5.5 |
2.5 |
1.0 |
0.7-1.2 |
| K1P3030 70Ag/30Pd 3030-1 Powder |
Embedded passive components in circuit boards |
2.8 |
17 |
13 |
0.9-2.7 |
| K7030-10 70Ag/ 30Pd Powder |
Embedded passive components in circuit boards |
1.8 |
1.2 |
0.9 |
0.6-1.6 |
| HZF0824 Platinum Flake |
Conductive epoxy adhesives |
4.0 |
1.5 |
1.0 |
0.7-1.4 |