Ferro EPM makes it easier to make electronics.
Ferro’s Electronic Packaging Materials (EPM) business provides a full range of materials and engineered products to meet your needs for hybrid circuits, microelectronics, advanced packaging, and devices.
Ferro has a long tradition of providing matched systems of engineered materials, as well as applied technology representatives to help you integrate our products into your manufacturing process. Our products are often customized for specific applications. Ferro continues to build on this tradition. In addition, many customers make electronic materials in-house, or use certain Ferro base materials for particular functions. Ferro EPM serves all of these markets.
Electronic and Technical Glasses
A leading manufacturer of electronic and specialty glass, Ferro has 80+ years of glass development expertise and a database of 3,000+ formulations. We can assist in your development and technology programs to create next-generation devices. Our high quality frits and powders are offered in a wide spectrum of standard products, as well as specialized custom and proprietary formulations.
Hybrid Integrated Circuit (HIC) Thick Film Materials
Ferro has long been a market leader in providing engineered electronic materials in matched systems for ease of manufacturing. Our HIC thick film material systems are widely used in telecommunications, automotive, medical, consumer, and military applications. Ferro also offers RoHS-compliant systems and a wide range of lead- and cadmium-free pastes.
Low Temperature Co-fired Ceramic (LTCC) Systems
Ferro offers a range of LTCC materials for components and modules used in medical electronics, consumer A/V, computers, wireless handsets, automotive subassemblies, data/telecom infrastructure equipment, and defense/aerospace.
Metal Core Substrates
Ferro’s MCS materials enable integration of electronic elements—particularly heating and cooling elements—on metal substrates to build additional functionality into structural parts. This reduces the overall size of end products and increases durability of circuits in a wide variety of applications.
Delivering material advantages
E-mail: epm@ferro.com