Ferro has many years’ experience in developing and marketing pastes for Thermistors, Piezos, Disks, and Varistors, including custom applications. Besides pastes for high lead-containing piezo discs and blocks, most of our paste products are lead-free and cadmium-free. Some pastes have such a wide range of properties that they are recommended for more than one application area. To select the most suitable paste, consult the table for the type of device, then check application method and firing limitations. Or contact Ferro for assistance.

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VDR Discs

Product	Solids Loading (%)	Ag/Pd Ratio	Metal Loading (%)	Firing Temp. (°C)	Thinner	Pb- & Cd-free	Application Method	Comments
61300033	83.0	100% Ag	80.6	600-750	68100063	Yes	Screen printing	High solids for thicker prints, solderable
61300029	81.0	100% Ag	78.7	600-750	68100063	Yes	Screen printing	Lower solids version of 61300033
61300031	74.0	100% Ag	70.0	600-750	68100063	Yes	Screen printing	Solderable

Thermistors – Ohmic Pastes for PTC

Product	Solids Loading (%)	Ag/Pd Ratio	Metal Loading (%)	Firing Temp. (°C)	Thinner	Pb- & Cd-free	Application Method	Comments
61400016	77.0	100% Ag	65 Ag 5 Zn 3B	600-640	68100063	Yes	Screen printing	Excellent ohmic combined with good conductivity. Typically used with solderable cover Ag paste 61300031
61400017	84.0	100% Ag	40 Ag 36 Zn	560-640	68100063	Yes	Screen printing	Low cost ohmic paste

Thermistors – Cover Pastes for PTC

Product	Solids Loading (%)	Ag/Pd Ratio	Metal Loading (%)	Firing Temp. (°C)	Thinner	Pb- & Cd-free	Application Method	Comments
61300031	74.0	100% Ag	70.0	600-700	68100063	Yes	Screen printing	Combined with ohmic pastes, provides protected/solderable surface
61320030	74.0	100% Ag	70.0	460-500	68100063	Contain Pb	Screen printing	Low cost ohmic paste
61320043	74.0	100% Ag	70.0	460-500	68100063	Yes	Screen printing	Pb-free version of 613200030

Thermistors – Pastes for NTC

Product	Solids Loading (%)	Ag/Pd Ratio	Metal Loading (%)	Firing Temp. (°C)	Thinner	Pb- & Cd-free	Application Method	Comments
61300033	83.0	100% Ag	80.6	600-750	68100063	Yes	Screen printing	High solids for thicker prints, solderable
61300029	81.0	100% Ag	78.7	600-750	68100063	Yes	Screen printing	Lower solids version of 61300033
61300031	74.0	100% Ag	70.0	600-750	68100063	Yes	Screen printing	Solderable

PZT – Paste Package for PZT Actuators

Product	Solids Loading (%)	Ag/Pd Ratio	Metal Loading (%)	Firing Temp. (°C)	Thinner	Pb- & Cd-free	Application Method	Comments
EL44-026	55.5	70/30	38.1 Ag 16.3 Pd	1050-1140	M1155	Yes	Screen printing	Inner electrode paste
61340001	73.4	100% Ag	70.0	650-750	68100063	Contain Pb	Screen printing	Base-paste to provide excellent adhesion and contact
61300023	83.0	100% Ag	70.0	560-600	68100063	Contain Pb	Screen printing	Cover-paste to provide excellent solderability in combination with paste 61340001

PZT – Pastes for Disc & Special PZT Applications

Product	Solids Loading (%)	Ag/Pd Ratio	Metal Loading (%)	Firing Temp. (°C)	Thinner	Pb- & Cd-free	Application Method	Comments
61340004	75.4	100% Ag	68.4	650-750	68100063	Contain Pb	Screen printing	Excellent adhesion and contact, solderable
61710063	70.0	100% Ag	64.0	600-700	68100063	Yes	Screen printing	Pb-free, solderable
TM63-112	71.0	100% Ag	63.0	800-850	M1028	Contain Pb	Screen printing	Excellent adhesion and contact, solderable
61200007	64.0	100% Ag	60.0	600-800	68100223	Yes	Spraying/Brushing	Solderable

Other Applications

Product	Solids Loading (%)	Ag/Pd Ratio	Metal Loading (%)	Firing Temp. (°C)	Thinner	Pb- & Cd-free	Application Method	Comments
TM63-152	77.0	100% Ag	74.0	680-730	M1028	Yes	Dipping	Outer electrode for chip inductors
64770017	82.5	53.3 Ag 13.3 Pd 3.1 Pt 0.5 Au	64.0	740-780	68100063	Yes	Dipping, screen printing	Outer electrode for ferrites and Mg-silicate inductors; solderable with high leach resistance