Ferro offers a broad selection of termination pastes for multilayer ceramic capacitors and multilayer VDR chips. Ferro's in-house metal and glass formulation and R&D enables us to customize products to meet specific needs, including:
- Matching rheology to various dipping methods and equipment
- Providing a strong bond to the ceramic
- Producing acid resistant glasses to prevent plating solution ingress in palatable applications
- Creating the right surface to allow excellent solderability as well as high leach-resistant formulations to avoid leaching and dewetting
- Working closely with customer to develop the optimum application methods such as dipping, drying, firing
As an added advantage, all our termination pastes are Lead-free and Cadmium-free.
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Solderable Ag, AgPd & AgPdPt terminations for MLC and MLV applications
| Product |
Solids
Loading (%) |
Ag/Pd
Ratio |
Metal
Loading (%) |
Firing
Temp. (°C) |
Thinner |
Comments |
| 61901445 |
75.0 |
100%Ag |
70 Ag |
760-800 |
68100170 |
Standard solderable Ag termination |
| 64770027 |
76.1 |
95/5 |
68.4 Ag
3.6 Pd |
780-820 |
68100028 |
Low cost low-Pd termination for adhesive fixing of chip; excellent humidity stability |
| 64770016 |
81.0 |
75/25 |
52.5 Ag
17.5 Pd |
770-830 |
68100170 |
Leach-resistant AgPd termination |
| 64770020 |
78.2 |
80/20 |
53 Ag
13.2 Pd |
650-750 |
68100063 |
Low-fire AgPd termination |
| 64770026 |
76.4 |
80/20 |
56 Ag
14 Pd |
600-650 |
68100254 |
Low-fire AgPd termination, where temperatures below 650°C are required |
| TK34-002 |
79.2 |
76/24 |
53.3 Ag
17.2 Pd
2.7 Pt |
770-810 |
M1028 |
High leach-resistant AgPdPt termination |
| 64770018 |
80.2 |
80/20 |
52.0 Ag
13.0 Pd
3.0 Pt |
740-780 |
68100063 |
High leach-resistant AgPdPt termination |
Platable Ag & AgPd terminations for MLC and MLV applications
| Product |
Solids
Loading (%) |
Ag/Pd
Ratio |
Metal
Loading (%) |
Firing
Temp. (°C) |
Thinner |
Comments |
| TM63-150 |
76.3 |
100%Ag |
73.5 Ag |
650-700 |
M1131 |
Very slow drying |
| TM63-152 |
77.0 |
100% Ag |
74.0 Ag |
650-700 |
M1028 |
Slow drying |
| 61710066 |
71.9 |
100% Ag |
69.6 Ag |
750-770 |
68100028 |
Faster drying than TM63-152 |
| 61720012 |
77.5 |
100% Ag |
75.0 Ag |
600-650 |
68100170 |
For low-fire application such as MLV |
| TM64-111 |
78.0 |
99.3/0.7 |
75.5 Ag
0.5 Pd |
620-680 |
M1183 |
Dippable termination for MLV chips |
| TM64-118 |
75.7 |
94.3/5.7 |
67.7 Ag
4.1 Pd |
730-780 |
M1183 |
For array striping application |
| TM64-121 |
75.5 |
97.2/2.8 |
69.2 Ag
2.0 Pd |
700-760 |
M1183 |
For larger chip sizes |
| TM64-122 |
75.4 |
99.3/0.7 |
70.6 Ag
0.5 Pd |
650-710 |
M1183 |
Alternative to TM64-111 |