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Ferro's Thick Film Materials lower costs, increase electrical output & improve yields.
The world's leading supplier of thick film photovoltaic materials for more than 20 years, Ferro provides global product manufacturing and regional support through applied technology labs.
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Read about our product line, below,
or view our Flash multimedia brochure
Our products and expertise help customers reduce silicon costs, deposition weight, breakage and floor space requirements while increasing performance and throughput. Ferro regularly presents technical papers at international PV conferences. For product data sheets, click on the links below.
Thick Film Material Systems for Crystalline Silicon Solar Cells
- Front surface metallization materials
- Back surface metallization materials
- Screen-printable diffusion solutions
- Aluminum BSF paste
- Thick film materials for thin film and other solar applications
Innovations Make Solar More Cost.Competitive
- Lead-free silver and aluminum materials meet emerging EU regulations
- All materials are cadmiun-free
- Front and rear silver Hot Melt formulations
- Front silver contacts optimized for silicon nitride ARC and textured wafers
- Low Bow aluminum BSF for thin silicon wafers
Following Data Sheets are in PDF format
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Front surface metallizations - Thick Film Silver Conductor Inks
Diffusion sources
Ag, Ag/Al back surface metallizations - Silver/Aluminum, Silver Back Surface Thick Film Conductor Inks
Al back surface metallizations - Aluminum Back Surface Thick Film Conductor Inks
Lead-free Materials Meeting Emerging EU Regulations
- 33-466 Lead Free Rear Silver
- PS 33-600 Lead Free Rear Silver
- PS 33-601 Lead Free Rear Silver/Aluminum
- PS 33-650 Hot Melt Lead Free Rear Silver
- PS 33-651 Hot Melt Lead Free Aluminum Back Surface Metallization
- AL 53-110 Thin Wafer, Lead Free Aluminum Back Surface Metallization
- AL 53-120 Series Thin Wafer, Lead Free Aluminum/Boron Back Surface Metallization
- AL 53-130 Lead Free Aluminum Back Surface Metallization for Sin ARCs
- LF 33-701 Lead Free Silver Conductor for Thin Film & Interconnect
Hot Melt Silver Condutor Inks
- NS 33-551 Hot Melt inks designed for SiN & TIO2 ARCs
- NS 33-552 Hot Melt inks designed for SiN ARCs
- NS 33-553 Hot Melt inks designed for SiN ARCs
- PS 33-650 Hot Melt Lead Free Rear Ag
- PS 33-651 Hot Melt Lead Free Rear Silver/Aluminum
- PS 33-652 Hot Melt High Adhesion Rear Ag
Thin Film & Interconnect Materials
- LF33-700 Low Temperature Silver Conductor
- LF33-701 Low Temperature Lead Free Silver Conductor
- LF33-750 Low Temperature Silver Polymer Silver Conductor
Legacy Products
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