AlN Materials

Application Product Description
Multilayer Au System CN30-010 Bottom Conductor, Au-wire bondable
CN30-012 Via Fill
C3066 Intermediate surface conductor
C3068N Surface conductor, Al-wire bondable
CN31-009 PtAu Solderpad conductor
DL10-054 Base Dielectric
2051 Surface dielectric
Ag System CN33-145 Ag, Solderable
CN34-100 AgPd, Solderable


Pb/Cd Free 
All other products comply with EU RoHS Directive 2002/95/EC with regard to exemption of lead contained in the glass system of thick film materials used in electronic components