51st International Symposium on Microelectronics
Pasadena, CA, USA
FERRO TO SHOWCASE EXPANDED PORTFOLIO AT IMAPS 2018
Ferro’s Electronic Materials group invites you to join us at IMAPS 2018, October 8-11, at the Pasadena Convention Center.
In booth #404, we will present our expanded portfolio, such as increased tape production capabilities, including LTCC and HTCC, as a result of Ferro’s acquisition of the former Electro-Science Laboratories (ESL).
This year IMAPS rolls out a new technical program that has been organized to help attendees find their key interests faster. It features 5 leading tracks with topics focused on the major package platforms including wafer level, flip chip, 2D/3D, SiP, as well as the traditional focus areas of reliability, advanced materials, and processes.
We look forward to meeting you at the IMAPS 2018.
VIEW FERRO ELECTRONIC MATERIALS PRODUCTS