Ferro Electronic Materials is pleased to announce that we will be participating in the SMTconnect 2019 exhibition in Nuremberg, Germany from May 7-9, 2019.
SMTconnect is a unique event in Europe in which the entire electronic production community comes together to share and discover technologies from development through final applications of microelectronic assemblies and systems. Covering the field of microelectronics from every angle, SMTconnect focuses on system development and production preparation, materials and components, processes and manufacturing, reliability and testing, and software and production control.
Experience the best materials and engineered products for devices in the electronic industry
Electronic packaging materials that will be displayed include hybrid integrated circuits (HIC), high temperature co-fired ceramics (HTCC), low temperature co-fired ceramics (LTCC), and more.
SMTconnect 2019 is a great opportunity to see the fruits of Ferro’s integration of Electro-Science Laboratories (ESL) into our Electronic Material Systems business. ESL’s product portfolio adds new capabilities to our advanced coating materials and technologies for metal, glass, ceramics, and other substrates, further cementing our position as the leading solution provider for electronic packaging materials.
“SMT is a perfect place for the electronic industry to renew existing business contacts with customers and specialists and to build new relationships. The show also provides a great opportunity for us to combine forces with our colleagues from ESL (ElectroScience Laboratories) following their acquisition at the end of 2016.“ said Oliver Heitmann, Ferro GmbH’s Business Manager, Electronics and Automotive.
SMTconnect 2019 is anticipated to be a huge event, with close to 500 exhibitors from 30 countries sharing their offering with some 12,000+ visitors. We look forward to seeing you there!
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