Passivation Glass Powders
Ferro offers a wide portfolio of high purity passivation glass powder compositions including lead-silicate, lead-borosilicate, and zinc-borosilicate glasses designed for passivating semiconductor devices.
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Our passivation glasses are formulated and processed to achieve very low alkali and iron levels. They can be applied to semiconductors by a variety of techniques including doctor blading, photo-spinning, sedimentation, screen printing, glass beading, and electrophoresis.
Passivation glass powders are available in several standard particle size distributions and grain sizes based on the specific application requirements. We also offer low expansion glass composite versions for large wafer and/or thick layer requirements.
Lead in glass for use in electronic components is RoHS exempt, enabling these products to be used in RoHS compliant applications.
- Wafer passivation of thyristors
- Wafer passivation of power transistors
- Wafer passivation of diodes
- Glass beading/encapsulation rectifiers
- Passivation and encapsulation of single-chip glass bead rectifier diodes
- Passivation and encapsulation of stacked-chip glass bead rectifier diodes
PASSIVATION GLASS POWDERS PRODUCT INFORMATION
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Ferro’s extensive research, development and analytical resources enables us to develop custom glass powders based on our customer’s specific applications with tailored properties including composition, firing temperature and CTE based on the materials used.