Low Temperature Lead-Containing Sealing Glass Pastes

Ferro offers a portfolio of standard lead-containing electronic glass pastes designed for hermetic sealing of electronic packages and devices at reduced firing temperatures.

Low Temperature Lead Containing Sealing Glass Pastes designed for sealing devices

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Our sealing glass pastes are formulated to achieve hermetic seals with a variety of substrate materials at peak firing temperature as low as 410°C, depending upon the application. The organic vehicle has been specially formulated to ensure complete binder burnout in the firing range of 280°C-360°C.   


LOW-TEMPERATURE LEAD-CONTAINING SEALING GLASS PASTE APPLICATIONS

Ferro’s in-house glass powder development and manufacture capabilities enables us to manufacture customized glass paste formulations for a variety of applications. 

Lead in glass for use in electronic components is RoHS exempt, enabling these products to be used in RoHS compliant applications.
 
Low Temperature Lead Containing Sealing Glass Pastes Application
  • Hermetic sealing of wafer-level MEMS packaging, automotive sensors and other micromechanical devices such as vibration sensors, yaw-rate sensors, and accelerometer sensors

  • Thick film sealing applications including alumina-based devices and packages

  • Thin seal for alumina devices and packages

  • Sealing of silicon to metal devices and packages for pressure sensor applications  

  • FERRO LEAD-BASED SEALING GLASS PASTES PRODUCT INFORMATION

    Ferro Lead-Based Sealing Glass Pastes Product Data 


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    VALUE ADDED SERVICES

    Ferro’s extensive research, development and analytical resources enable us to develop custom glass pastes based on our customer’s specific applications with tailored properties including composition, firing temperature and CTE based on the materials used.