Low Temperature Lead-Free Sealing Glass Pastes

Ferro offers a portfolio of lead-free glass pastes designed to achieve hermetic seals for sensors and other devices at reduced firing temperatures.

Lead-free glass pastes designed for sealing low thermal expansion substrates such as silicon and soda lime at a reduced firing temperature.

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Ferro sealing glass pastes are formulated to seal with a variety of substrate materials at peak firing temperature as low as 430°C, depending upon the application. The organic vehicle has been specially formulated to ensure complete binder burnout in the firing range of 280°C-360°C.

DL11-205 and DL11-210 are lead-free and cadmium-free glass paste that can be used in RoHS and REACH compliant packages and devices. DL11-210 is an alkali-free formulation for use in signal sensitive applications.


LOW TEMPERATURE LEAD-FREE SEALING GLASS PASTES APPLICATIONS
Ferro’s in-house glass powder development and manufacture capabilities enables us to manufacture customized glass paste formulations for a variety of applications. 


Lead-free glass pastes designed for sealing low thermal expansion substrates such as silicon and soda lime at a reduced firing temperature.
  • Hermetic sealing of wafer level MEMS packaging, automotive sensors and other micro-mechanical devices such as vibration sensors, yaw-rate sensors, and accelerometer sensors

  • Sealing of silicon to metal devices and packages for pressure sensor applications
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Ferro also develops custom formulations based on customer’s specific applications with custom properties including composition, firing temperature and CTE based on the materials used.