Thick Film Conductor Materials for HTCC Applications
Ferro offers thick-film platinum and tungsten conductors designed to be co-fired with refractory zirconia tapes and alumina tapes. These refractory ceramic tapes and conductor pastes are co-fired at high peak temperatures over 1,400⁰ C.
Our platinum and tungsten conductors, surface, buried and via-fills are specifically formulated for compatibility with refractory zirconia and alumina ceramic tapes.
Ferro’s thick film conductor materials are manufactured to be lead-free, cadmium-free and phthalate-free. All our thick film conductor materials for HTCC applications are formulated to be RoHs and REACH compliant.
FERRO THICK FILM CONDUCTOR MATERIALS FOR HTCC APPLICATIONS
|THICK FILM CONDUCTORS and MATERIALS||DESCRIPTION||TYPICAL APPLICATIONS|
|5570 Platinum Conductive Paste||Porous platinum thick film conductor paste designed to be co-fired with partially stabilized zirconia tape at high temperatures||Applications include as electrodes in planar sensors|
|5571 Platinum Conductive Paste||Designed to be co-fired with alumina tape at high temperatures||Applications include as heaters in planar sensors|
|5574 Platinum Conductive Paste||Designed to be co-fired with alumina tape at high temperatures||Applications include leads or contact pads in planar sensors|
|5574-A Platinum Co-Firing Conductive Paste||Designed to be co-fired with alumina tape at high temperatures. 5574-A is a slightly lower resistivity version of 5574||Applications include leads or contact pads in planar sensors|
|5575 Platinum Conductive Via Fill||Designed to be co-fired with alumina tape or partially stabilized zirconia at high temperatures||Applications include as via fill in planar sensors|
|5575-C Platinum Co-Firing Conductive Via Fill||Designed for use on refractory ceramic green tapes for use as a buried layer conductor; contains glass/ceramic binder||Applications include as via fill in planar sensors|
Ferro has over 20 years of experience in designing and manufacturing thick film materials and products formulated specifically for high temperature co-fired ceramics (HTCC) applications.
Successful processing and firing of multilayer co-fired structures utilized in various sensors requires knowledge of dimensional stability during layer build and printing, shrinkage during firing, and the necessary firing regime to ensure that flat, blister-free parts are produced. Our customers can leverage our prototype-building equipment and expertise in these processing aspects.
We also provide training at our own facilities or on-site at our customers’ locations, with comprehensive programs that cover most aspects of sensor manufacturing including materials, equipment, prototype building, testing and evaluation processes.