Silver Conductor Pastes

We offer silver conductor pastes formulated for use in a variety of hybrid circuits, display applications, chip resistors and passive components.

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Our silver interconnects provide a balance between reliability and cost for a variety of hybrid devices, and our silver conductor pastes are used to create buried interconnects, via fill, via plugs and terminations. Ferro silver conductor pastes can also be used as a direct termination using an aluminum wire bond.

Additional applications for silver conductor pastes include the creation of fine features used in passive components, such as chip resistors and display component interconnects. Several of our silver pastes are designed to be plated with nickel and gold for improved solderability and gold wirebonding. Ferro silver pastes can also be co-fired with low temperature co-fired ceramic (LTCC) tapes to create integrated multilayer electronic packages.

RoHS and REACH compliant versions are available for most types of our silver pastes.

Silver Conductor Paste Key Applications
  • Aluminum Wire Bonding
  • Fine-line Printing
  • Resistor Termination
  • Via Fill
  • Display
  • Multi-layer Components
  • Low Temperature Co-fired Ceramics