CMP SLURRIES FOR BARE SILICON WAFERS
Ferro is a leading global manufacturer of optimized high-purity slurries designed to deliver optimal performance in bare silicon wafer CMP (chemical mechanical planarization) applications.
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We also work with our customers to design custom polishing products with tailored properties required for our customers’ increasingly complex CMP process requirements.
SN8001 CMP SLURRY FOR BARE SILICON WAFERS- CHARACTERISTICS
- Colloidal silica-based alkaline slurry
- Tunable Si removal rate
- High dilution rate up to 1:30
- Low defectivity
- Good Si wafer surface roughness
- Cost competitive
FERRO SN8001 for BARE SILICON CMP SLURRIES REMOVAL RATES
Higher Diluted Ratio and Removal Rate (R.R.)
CMP SLURRY FOR BARE SILICON
|SLURRY||SN8001||POU (POINT OF USE: STANDARD PAD
CENTER AREA SLURRY APPLICATION
|particle Size||60 nm||40 nm|
|Ni2+||< 50 ppb||< 2000 ppb|
|Al3+||< 5000 ppb||< 5000 ppb|
|Fe3+||< 5000 ppb||< 5000 ppb|
CMP PERFORMANCE-DEFECTS AND METAL IONS
Silicon Wafer Surface Particle-Less Particle Counts after CMP Process
Comparable Metal Ions in Silicon Wafer
CMP SLURRIES FOR BARE SILICON PRODUCT INFORMATION
VALUE ADDED SERVICES
With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.
Our expertise in abrasive particle development and manufacturing technology allows us to optimize the physical and chemical properties needed to deliver optimal solutions for our customers’ varied polishing applications.