CMP SLURRIES FOR BARE SILICON WAFERS

Ferro is a leading global manufacturer of optimized high-purity slurries designed to deliver optimal performance in bare silicon wafer CMP (chemical mechanical planarization) applications.

CMP Slurries for Bare Silicon Wafers

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We offer a wide range of CMP slurries that are designed for the primary and secondary polishing of bare silicon wafers. Our CMP slurries achieve optimal metal CMP removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space. 
  
We also work with our customers to design custom polishing products with tailored properties required for our customers’ increasingly complex CMP process requirements.

SN8001 CMP SLURRY FOR BARE SILICON WAFERS- CHARACTERISTICS

  • Colloidal silica-based alkaline slurry
  • Tunable Si removal rate
  • High dilution rate up to 1:30
  • Low defectivity
  • Good Si wafer surface roughness
  • Cost competitive

FERRO SN8001 for BARE SILICON CMP SLURRIES REMOVAL RATES 
Higher Diluted Ratio and Removal Rate (R.R.)

CMP SLURRY FOR BARE SILICON

SLURRY  SN8001  POU (POINT OF USE:  STANDARD PAD
CENTER AREA SLURRY APPLICATION
Particle Type  SiO2  SiO2 
particle Size   60 nm 40 nm 
pH  11~11.5  11~11.5 
Sp. Gr.  1.1~1.2  1.1~1.2  
Ni2+  < 50 ppb  < 2000 ppb 
Al3+  < 5000 ppb  < 5000 ppb 
Fe3+  < 5000 ppb  < 5000 ppb 
Dilute  20X~30X  20X 

CMP PERFORMANCE-DEFECTS AND METAL IONS

Silicon Wafer Surface Particle-Less Particle Counts after CMP Process
CMP PERFORMANCE-METAL IONS
Comparable Metal Ions in Silicon Wafer 

CMP SLURRIES FOR BARE SILICON PRODUCT INFORMATION

Ferro CMP Slurries for Bare Silicon Product Data 


ELECTRONIC MATERIALS VALUE ADDED SERVICES

VALUE ADDED SERVICES
With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.

Our expertise in abrasive particle development and manufacturing technology allows us to optimize the physical and chemical properties needed to deliver optimal solutions for our customers’ varied polishing applications.