CMP SLURRIES FOR RECLAIM WAFERS

Ferro is a leading global manufacturer of optimized high-purity slurries with excellent stability designed for CMP polishing wafers for reclaim processing.

CMP Slurries for Reclaim Wafers

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We offer a wide range of alumina-based CMP slurries for polishing reclaims wafers that provide a better polishing capability for complex hard films with high throughput. Ideal for mechanical polishing, our slurries have a good surface roughness that delivers low defectivity.

Our CMP slurries achieve optimal metal CMP removal rates and have an excellent shelf life, resulting in decreased cost of ownership and increased productivity using existing equipment and space.    

SN8005 RECLAIM WAFER CMP SLURRIES  
We also work with our customers to design custom polishing products with tailored properties required for our customers’ increasingly complex CMP process requirements.
RECLAIM WAFER CMP SLURRY PRODUCT PROPERTIES 
FERRO SN8004 RECLAIM WAFER CMP SLURRY CHARACTERISTICS
  • Colloidal silica-based alkaline slurry
  • High removal rates (RRs)
  • High throughput
  • Low defectivity
  • Good surface roughness
  • Excellent slurry stability and shelf-life
REMOVAL RATES of SN8004 SLURRIES
Ferro Reclaim wafer CMP slurries provide higher removal rates by 30-50% and better polishing performance than the competitor E.

FERRO SN8005 RECLAIM WAFER CMP SLURRIES REACTION MECHANISM

PHYSICAL PROPERTIES for SN8005 SLURRIES

ITEM  POU  SN8005-CIP 
pH  10.92  10.5 
Solid Content %  11.02  10.58 
Mean Particle Size (nm)  0.62  0.85 
Removal Rate  (µm/min)1 600 ~ 800  300 ~ 500 
Dispersing Ability  Poor   Best

1With 1:2 dilute for polishing reclaim wafers (32" Speedfamtool) with 2.0 kgf/cm2 down force and 40 rpm/min rotation speed


FERRO SN8005 RECLAIM WAFER CMP SLURRY CHARACTERISTICS
  • Alumina-based alkaline slurry
  • Better polishing capability for complex hard films
  • High removal rates (RRs)
  • High throughput
  • Low defectivity
  • Good surface roughness
  • Excellent slurry stability and shelf-life
REMOVAL RATES of SN8005 SLURRIES
The SN8005 CIP slurry product is enhanced by a removal rate of 30-40%

RECLAIM WAFER CMP SLURRIES PRODUCT INFORMATION

Ferro SN8005 Reclaim Wafer CMP Slurry Product Data 


ELECTRONIC MATERIALS VALUE ADDED SERVICES

VALUE ADDED SERVICES
With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.

Our expertise in abrasive particle development and manufacturing technology allows us to optimize the physical and chemical properties needed to deliver optimal solutions for our customers’ varied polishing applications.