COPPER BARRIER CMP SLURRIES for METAL REMOVAL

Ferro is a leading global manufacturer of optimized high-purity copper barrier slurries designed to deliver optimal performance in metal CMP (chemical mechanical planarization) applications.

Copper Barrier CMP Slurries for Metal Removal

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The Ferro product line of copper barrier cmp slurries provides a wide range of aqueous copper barrier slurries designed to remove the barrier metals that are exposed following copper clearing. Our copper barrier CMP slurries achieve optimal metal CMP removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space.

SN4501 copper barrier CMP slurries feature a tunable removal rate for copper barrier and oxide with linear response to downforce.

Selectivity is also tunable for copper/TEOS which allows a good oxide loss control and results in low surface roughness.

FERRO SN4501 COPPER BARRIER CMP SLURRIES REMOVAL RATES

REMOVAL RATES  (Å/min) @ 1.7 psi DOWNFORCE

Species SN4501
Ta  670 
TaN  1149 
TEOS  1282 
Cu  588 
Cu / TEOS 2.18 

We also work with our customers to design custom polishing products with tailored properties required for a specific application.
ELECTRONIC MATERIALS VALUE ADDED SERVICES

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With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.

Our expertise in abrasive particle development and manufacturing technology alows us to optimize the physical and chemical properties needed todeliver optimal solutions for our customers’ varied polishing applications.