COPPER CMP SLURRIES FOR METAL REMOVAL

Ferro is a leading global manufacturer of optimized high-purity copper CMP slurries designed to deliver optimal performance in metal CMP (chemical mechanical planarization) applications.

Copper CMP Slurries for Metal Removal

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The Ferro copper CMP slurry product line offers a wide range of aqueous slurries that achieve optimal metal CMP removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space.
Ferro 2070 Copper CMP Slurries for Metal Removal Advantages
ADVANTAGES of SN2070 COPPER CMP SLURRIES FOR METAL REMOVAL
  • Neutral formula
  • Low abrasive concentration (colloidal silica) and good defect performance
  • Tunable Cu polishing rate and excellent customization ability
  • High selectivity (Cu/Ta>2000)
  • Superb planarization performance
  • High dilute ratio (> 10X concentration) for lower cost of ownership
  • Improved line yield for ultra-low Cu corrosion rate
  • Qualified in HVM from 130nm to 45nm

SN2070 COPPER CMP SLURRY

SN2070 Copper Slurry Metal Removal Rate vs Down Force

The SN20701 copper slurry offers a tunable removal rate for copper with linear response to downforce. 


COPPER CMP SLURRY DISHING RESULTS 
Dishing results below show qualified performance.

 

L/S ARRay (um)  AVE Dishing (Å) 
100/100 800 
50/50 770 
10/10  520 

We also work with our customers to design custom polishing products with tailored properties required for a specific application.
ELECTRONIC MATERIALS VALUE ADDED SERVICES

VALUE ADDED SERVICES
With over 40 years of surface finishing experience, Ferro’s research, development and analytical resources enable us to develop unique polishes and abrasives for polishing a variety of substrates including plastic, glass, automotive clear coats, and sapphire.

Our expertise in abrasive particle development and manufacturing technology allows us to optimize the physical and chemical properties needed to deliver optimal solutions for our customers’ varied polishing applications.